| 摘要 |
PURPOSE: A copper clad laminated plate and an embedded package thereof are provided to prevent a short-circuit between a copper clad laminated plate and an additional wiring by improving the planarity of a copper clad laminated plate. CONSTITUTION: A copper-clad laminated plate(100) comprises a bonding layer(102) and a porous metal layer(104). The bonding layer comprises a thermosetting or thermoplastic resin. The porous metal layer is attached to one side of the bonding layer. A concavo-convex part is formed on the contact surface of the bonding layer and the porous metal layer. The concavo-convex part has a claw shape. The concavo-convex part is a nano wire which is emanates from the porous metal layer.
|
