| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component packaging structure and a method of coating resin, capable of securing packaging reliability by appropriately forming a resin reinforced section for reinforcing the retention force of a solder joint. <P>SOLUTION: Corner reinforcing sections 70 of a corner section 6c in electronic components 6 include a first resin line 7a formed with length less than 1/2 side length of one side from among four sides for constituting a rectangle, while including the corner section 6c and reinforcing the electronic components; and a second resin line 7b formed for another side orthogonal to the first resin line 7a. Furthermore, the electronic component packaging structure includes: a first resin extension section 7c extended by prescribed length in an outer direction from the first and second resin lines 7b, and a second resin extension section 7d. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
