| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for processing a substrate surface which facilitates removal workability of the substrate surface affected by a high reactive substance produced by underwater plasma, improves stability of the plasma, and can suppress generation of a through-hole or a plurality of irregularities other than these originality intended, and a device for processing the same. Ž<P>SOLUTION: In the method for processing the substrate, plasma is produced under water and removal processing of the surface of the substrate 1 to be processed is performed by supplying fine particles 4. The plasma is generated by providing an electrical field between opposite electrodes 21, 22 other than the substrate 1 disposed in the water, and a high-reactive substance and the particles 4 generated by the underwater plasma production are supplied to the substrate 1 using the water flow. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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