METHOD OF MANUFACTURING AND METHOD OF INSPECTING BASE MATERIAL FOR PRINTED WIRING BOARD HAVING MULTIPLE DEVELOPMENT PATTERNS FORMED, METHOD OF MANUFACTURING AND METHOD OF INSPECTING MULTIPLE-PATTERNED PRINTED WIRING BOARD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND EXPOSURE MASK

摘要

<P>PROBLEM TO BE SOLVED: To easily decide that the amount of a relative position shift between wiring patterns as adjacent units formed on a multiple-patterned printed wiring board is to exceed or has exceeded a prescribed value without using a measuring machine etc., increasing the number of processes, nor increasing the cost. Ž<P>SOLUTION: A photosensitive resin film 5 on a base material 3 for a printed wiring board is exposed through an exposure mask 6 to form an exposed pattern part 22a and an unexposed pattern part 21a for position precision decision making, and the base material 3 is fed in steps to form an unexposed pattern part 21a having smaller area than the exposed pattern part 22a at a position corresponding to the exposed pattern part 22a and an exposed pattern part 22a having larger area than the unexposed pattern part 21a at a position corresponding to the unexposed pattern part 21a. When the amount of the relative position shift between adjacent units exceeds the prescribed value K, part of the unexposed pattern part is left as an unexposed pattern 23 for position shift decision making and developed to form a developed pattern 23a for position shift decision making. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž