发明名称 PACKAGE FOR LIGHT EMITTING DEVICE AND METHOD FOR PACKAGING THE SAME
摘要 There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.
申请公布号 US2010220473(A1) 申请公布日期 2010.09.02
申请号 US20100784237 申请日期 2010.05.20
申请人 PARK JUN SEOK 发明人 PARK JUN SEOK
分类号 F21V9/00;F21S4/00;F21V1/00;F21V5/00;F21V7/00;F21V29/00;H01L33/54;H01L33/58;H01L33/62 主分类号 F21V9/00
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