| 摘要 |
<p>Provided is a metal-clad polyimide resin substrate produced by subjecting one or both surfaces of a polyimide resin film to surface modification by a dry process, forming a barrier layer by a dry process, forming a seed layer by a wet or dry process, and then forming an electrically conductive coating on the surface layer by a wet process. The metal-clad polyimide resin substrate is characterized in that: in the exposed surface of the electrically conductive coating side which has been formed by subjecting the metal-clad polyimide resin substrate to the 90° peel test, the coexistent layer where both a residue of the polyimide and a residue of the barrier metal layer coexist in a mixed state has a thickness of 0.70nm or less in terms of Si sputtering rate as determined by depth profiling using a time-of-flight secondary ion mass spectrometer (TOF-SIMS); and the retention of peel strength after the aging test of 150°C and 168 hours (peel strength after aging at 150°C for 168 hours/initial peel strength) is 50 % or higher.</p> |
