PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME

摘要

Disclosed is a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator and (D) a sensitizing dye, wherein the binder polymer (A) has a constituent unit derived from (meth)acrylic acid and a constituent unit derived from (meth)acrylic acid benzyl ester or a (meth)acrylic acid benzyl ester derivative, the photopolymerizable compound (B) comprises a compound having one ethylenically unsaturated bond, and the sensitizing dye (D) comprises a compound represented by general formula (1). In formula (1), R1 and R2 independently represent a substituted or unsubstituted phenyl, thienyl or furyl group; R3 represents an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or an alkylester group having 1 to 10 carbon atoms; a and b independently represent an integer of 0 to 2; and m represents an integer of 0 to 5.