| 摘要 |
The invention is directed to improvements to the temperature control systems and methods used within a food processing and dispensing device. Specifically, the present invention measures, by a thermocouple assembly, the actual temperature of food product ingredients and transmits one or more signals to a CPU. The signals represent the actual temperature of the one or more food product ingredients measured by the first thermocouple assembly. Then the CPU employs one or more look-up tables within the CPU to determine a set point temperature of a food processing surface. The system and/or method measures the actual temperature of the food processing surface, using a second thermocouple assembly, and transmits one or more signals to the CPU representing the actual temperature of the food processing surface. The temperature of the food processing surface is then dynamically adjusted to the determined set point to offset the temperature of the food product ingredients.
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