| 摘要 |
The present invention provides a bonding structure of circuit substrates for instant circuit inspecting. The contact pad design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first contact pad, and then passes the conductive particles again to the detecting part from the first contact pad. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first contact pad and the circuit part is validated, or, if not, the bonding structure is invalidated.
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