A METALLIZATION SYSTEM OF A SEMICONDUCTOR DEVICE INCLUDING METAL PILLARS HAVING A REDUCED DIAMETER AT THE BOTTOM

摘要

In a metallization system of a complex semiconductor device, metal pillars (271) such as copper pillars may be formed in a nail-like configuration in order to reduce the maximum mechanical stress acting on the metallization system while providing a required contact surface for connecting to the package substrate. The nail-like configuration may be obtained on the basis of appropriately configured resist masks.