摘要 |
<P>PROBLEM TO BE SOLVED: To provide a hardening resin composition wherein a hardened material, which is suitable for a sealant for a light-emitting diode and a filler for an organic EL panel, is excellent in optical transparency and heat resistance, and has a low cure shrinkage, a low elastic modulus, and a low water absorption percentage, can be obtained. <P>SOLUTION: The hardening resin composition for a light-emitting diode sealant contains polybutylene glycol di(meth)acrylate and alicyclic (meth)acrylate; the hardening resin composition for an organic EL panel filler contains polybutylene glycol di(meth)acrylate and alicyclic (meth)acrylate; and alicyclic (meth)acrylate is preferably isobornyl (meth)acrylate or fenchyl (meth)acrylate. <P>COPYRIGHT: (C)2010,JPO&INPIT |