发明名称 HARDENING RESIN COMPOSITION, SEALANT COMPRISING HARDENED MATERIAL OBTAINED THEREBY, AND FILLER
摘要 <P>PROBLEM TO BE SOLVED: To provide a hardening resin composition wherein a hardened material, which is suitable for a sealant for a light-emitting diode and a filler for an organic EL panel, is excellent in optical transparency and heat resistance, and has a low cure shrinkage, a low elastic modulus, and a low water absorption percentage, can be obtained. <P>SOLUTION: The hardening resin composition for a light-emitting diode sealant contains polybutylene glycol di(meth)acrylate and alicyclic (meth)acrylate; the hardening resin composition for an organic EL panel filler contains polybutylene glycol di(meth)acrylate and alicyclic (meth)acrylate; and alicyclic (meth)acrylate is preferably isobornyl (meth)acrylate or fenchyl (meth)acrylate. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010189471(A) 申请公布日期 2010.09.02
申请号 JP20090032647 申请日期 2009.02.16
申请人 MITSUBISHI RAYON CO LTD 发明人 MATSUMURA KAZUNARI;OGURA KUNIYOSHI;ANZAI RYUICHI;NOGAMI HIROYUKI
分类号 C08F220/28;C08F220/12;H01L23/29;H01L23/31;H01L33/52;H01L51/50;H05B33/04 主分类号 C08F220/28
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