| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve high accuracy, low-load and low-impact conveyance by avoiding a load of a mechanism for feeding/exhausting a gas from being applied to a conveyance system for chucking and conveying a semiconductor chip. <P>SOLUTION: A vacuum chuck head includes a vacuum chuck collet 12 for chucking a flip-chip W, and an ejector 11 which includes a suction duct 25 communicated to the vacuum chuck collet and reduces pressure inside the suction duct by proximately confronting an air feeding port 21a to a compressed air feeding part 18. The vacuum chuck head is moved without being brought into contact with the compressed air feeding part. <P>COPYRIGHT: (C)2010,JPO&INPIT |
