| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an MEMS interconnection pin enhancing the manufacture yield and reducing the lead time and the cost, and a structure of the MEMS interconnection pin. <P>SOLUTION: A Micro-Electro-Mechanical-Systems (MEMS) interconnection pin 51 is fabricated on a sacrificial layer 23, which is formed on a conductive layer 12 and a substrate 11. The MEMS interconnection pin has a pin base 58 attached to a frame 38 that has direct contact to the conductive layer. The sacrificial layer is then removed, at least partially, to detach the MEMS interconnection pin from the substrate. In one embodiment, the MEMS interconnection pin has a pin base, two springs extending out from two different surfaces of the pin base, and a tip portion attached to each spring. The tip portions include one or more contact tips 45 to make contact to conductive subjects. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
