发明名称 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can freely adjust a resistance value of a metal silicide layer, irrespective of thickness of the metal silicide layer in a part including a boundary part. Ž<P>SOLUTION: The semiconductor device is provided with an N channel-type transistor forming region 14 and a P channel-type transistor forming region 16, which are formed in a semiconductor substrate 12; and a gate electrode which extends over the N channel-type transistor forming region 14 and the P channel-type transistor forming region 16, has the part, including the boundary part, which is formed in a region including a boundary line L of the N channel-type transistor forming region 14 and the P channel-type transistor forming region 16; and a non-boundary part formed in a region which does not include the boundary line and is provided with a conductive silicon layer 28 and the metal silicide layers 30 (30A and 30B), which are formed on a surface of the conductive silicon layer 28 and in which thickness, in the part that includes the boundary part and that in the non-boundary part differ. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010192523(A) 申请公布日期 2010.09.02
申请号 JP20090032762 申请日期 2009.02.16
申请人 OKI SEMICONDUCTOR CO LTD 发明人 NARITA TADASHI
分类号 H01L21/8238;H01L21/28;H01L21/3205;H01L23/52;H01L27/092;H01L29/423;H01L29/49 主分类号 H01L21/8238
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