| 发明名称 |
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR PREPARING THE SAME, KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE |
| 摘要 |
A chemical mechanical polishing aqueous dispersion includes (A) a sulfonic acid group-containing water-soluble polymer, (B) an amino acid, (C) abrasive grains, and (D) an oxidizing agent.
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| 申请公布号 |
US2010221918(A1) |
申请公布日期 |
2010.09.02 |
| 申请号 |
US20080676272 |
申请日期 |
2008.08.12 |
| 申请人 |
JSR CORPORATION |
发明人 |
TAKEMURA AKIHIRO;MENO MITSURU;SHIMOYAMA YUUJI;SHIDA HIROTAKA |
| 分类号 |
H01L21/304;C09K13/00;H01L21/306 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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