| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce the surface mounting area of a circuit board by inserting an element into a cavity which is formed inside a core member. CONSTITUTION: A core member comprises a base film(102), a first metal foil, and a second metal foil. A first circuit pattern layer(110) is formed on the first side of the base film. A second circuit pattern layer(111) is formed on the second side of the base film. A cavity in which a semiconductor chip is stored is formed by etching the base film. The semiconductor chip and the second circuit pattern layer are electrically connected by inserting the semiconductor chip through a cavity. |
