<p>PURPOSE: A method of manufacturing a thin film device is provided to efficiently transfer a thin film device while simplifying whole process. CONSTITUTION: A sacrificial layer(30) is formed on a reserved board(10). A thin film laminated article(40) is formed on the sacrificial layer to install the desired thin film element(40a). The thin film element connect the desired thin film to a non-device region partly by using a selective etching trough which the sacrificial layer is exposed to the outside. The sacrificial layer is removed through an exposed area of the sacrificial layer.</p>
