| 发明名称 |
ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition that highly satisfies low temperature processability (low temperature adhesiveness) and reflow resistance, and is sufficiently cured by a thermal history received in an assembling process after die bonding. <P>SOLUTION: This adhesive composition includes: a thermoplastic resin having a glass transition temperature of ≤100°C; and a thermosetting component containing an aromatic vinyl compound and a maleimide compound having a maleimide group. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| 申请公布号 |
JP2010189469(A) |
申请公布日期 |
2010.09.02 |
| 申请号 |
JP20090032630 |
申请日期 |
2009.02.16 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
MASUKO TAKASHI;KATOGI SHIGEKI;IZAWA HIROYUKI |
| 分类号 |
C09J179/08;C09J5/00;C09J7/00;C09J7/02;C09J11/00;C09J163/00;C09J201/00;H01L21/02;H01L21/52 |
主分类号 |
C09J179/08 |
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