| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound suitable for use as an inter-layer insulation film material in a semiconductor element device, and the like, with little film reduction in curing the film, capable of producing a film with an excellent dielectric constant, a composition containing the compound, and a film obtained from the composition. SOLUTION: The compound is formed by Diels-Alder reaction of (A) a compound having a dienophile structure, and (B) a compound having a cyclic or straight chain conjugated diene structure. It discharges (B) the compound having the conjugated diene structure via inverse Diels-Alder reaction by heating, light irradiation, radiation irradiation or a combination thereof. COPYRIGHT: (C)2010,JPO&INPIT |
