| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for reducing the generation of peeling between an island and a package body, in a semiconductor device including the island, made of metal sheet and mounting at least a semiconductor element on the surface thereof, and the package body, made of synthetic resin and sealing the semiconductor element so as to expose the rear surface of the island. SOLUTION: Stepped parts 6, the thickness of the parts is thinned by one step compared with the original thickness of the island, are provided at the outside parts of the semiconductor element 1 in the upper surface 2a of the island 2. COPYRIGHT: (C)2010,JPO&INPIT |
