| 摘要 |
PROBLEM TO BE SOLVED: To reduce a footprint of a chip in a wiring group and a buffer circuit. SOLUTION: A semiconductor integrated circuit device includes a group of wirings which are wired in parallel first to N-th (N is integer of 2 or above) wiring positions that are arranged in order and which are divided into a start end side and a terminating end side, and an M-th buffer circuit connection wiring of the starting end side of the M-th (M is the integer satisfying 1≤M≤K, and K is the integer satisfying K≤N/2) wiring position as input and wiring of the terminating end side of the (M+N-K)th wiring position as output. The wiring group has a structure where connection is switched so that wiring on the starting end side of J-th (J is the integer satisfying K<J≤N) wiring position is routed to wiring of the terminating end side of (J-K)th wiring position in a wiring layer above an arrangement region of the buffer circuit. COPYRIGHT: (C)2010,JPO&INPIT
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