SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND DESIGN METHOD

摘要

<P>PROBLEM TO BE SOLVED: To reduce a semiconductor chip size without being restricted by a minimum pad interval. Ž<P>SOLUTION: The semiconductor wafer (1) includes wires (20) each used for short-circuiting pads (11a, 11b) to which the same signal is applied in wafer level burn-in to each other. The wires (20) are laid out outside regions of semiconductors (10a, 10b), and partially included in a dicing region (30). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž