发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 An IC card is more expensive than a magnetic card, and an electronic tag is also more expensive as a substitute for bar codes. Therefore, the present invention provides an extremely thin integrated circuit that can be mass-produced at low cost unlike a chip of a conventional silicon wafer, and a manufacturing method thereof. One feature of the present invention is that a thin integrated circuit is formed by a formation method that can form a pattern selectively, on a glass substrate, a quartz substrate, a stainless substrate, a substrate made of synthetic resin having flexibility, such as acryl, or the like except for a bulk substrate. Further, another feature of the present invention is that an ID chip in which a thin film integrated circuit and an antenna according to the present invention are mounted is formed.
申请公布号 US2010221870(A1) 申请公布日期 2010.09.02
申请号 US20100776870 申请日期 2010.05.10
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 MAEKAWA SHINJI;FUJII GEN;MARUYAMA JUNYA;TAKAYAMA TORU;FUKUMOTO YUMIKO;ARAI YASUYUKI
分类号 H01L21/50;G06K19/077;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L27/13;H01L29/786 主分类号 H01L21/50
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