发明名称 CONDITION MONITORING DEVICE
摘要 <p>A condition monitoring device for monitoring the conditions of a subject, wherein a attaching body to be attached to the subject is reduced in weight and cost without impairing the accuracy of the measurement of the conditions of the subject. A condition monitoring device provided with an attaching body to be attached to a subject, and also with a body section for communicating with the attaching body. The attaching body is provided with a contact surface coming in contact with a measurement portion, a winding section having two curved holding surfaces for holding the outer peripheral surface of the measurement portion, a processing section disposed on the contact surface and having a semiconductor temperature sensor, and an antenna section disposed on the winding section. The body section outputs an electromagnetic wave at predetermined time intervals to cause the antenna section to generate an induction electromotive force, and the body section is provided with a communication section for receiving the output from the semiconductor temperature sensor, and also with a display section for displaying data relating to the body temperature of the subject calculated on the basis of the result of the communication by the communication section.</p>
申请公布号 WO2010098022(A1) 申请公布日期 2010.09.02
申请号 WO2010JP00763 申请日期 2010.02.09
申请人 TERUMO KABUSHIKI KAISHA;NAKAO, KOJI;OZAWA, HITOSHI;SEKINE, YUUSUKE 发明人 NAKAO, KOJI;OZAWA, HITOSHI;SEKINE, YUUSUKE
分类号 A61B5/01;A61B5/00;G01K1/02;G01K7/00 主分类号 A61B5/01
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