CONNECTOR WITH GUIDE FOR BALL GRID ARRAY PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a connector with guide for a BGA (Ball Grid Array)package attaining sure connection of a solder ball of a small-sized BGA type semiconductor device, hardly damaging the device and high in accuracy of measurement of high frequency characteristics. SOLUTION: The connector with guide for the ball grid array package includes a sheet-shaped connector 10 and a sheet-shaped solder ball guide 20 made of an insulator. The connector 10 has an insulating rubber sheet 11 and a plurality of metal wires 12 disposed in a thickness direction of the insulating rubber sheet 11 and is provided with a protruding part 10b formed by protruding a part corresponding to the solder ball of the semiconductor device on its surface with which the semiconductor device is connected. A solder ball guiding through-hole 21 into which the protruding part 10b of the connector 10 is inserted is formed in the solder ball guide 20 and the leading end of the protruding part 10b of the connector 10 is disposed within the solder ball guiding through-hole 21. COPYRIGHT: (C)2010,JPO&INPIT