Heat sink with forced ventilation, particularly for high-power electronic devices

摘要

A heat sink (1) with forced ventilation, particularly for high-power electronic devices comprises a dissipation plane (2) which can be connected thermally to an electronic device (9) to be cooled and is jointly connected to a plurality of cooling fins (3) which protrude substantially at right angles from the dissipation plane (2) and define a plurality of ducts (6) for the passage of forced air in order to conduct the forced air and cool the cooling fins (3), the passage ducts (6) are arranged in a grid and run substantially parallel to the dissipation plane (2).