发明名称 Test structure for integrated circuits
摘要 A test insert 100 for an integrated circuit according to the present invention comprises access contacts 101, 103 and 104 and an electrical path 110. Furthermore, there may be additional access contacts and a plurality of different electrical paths. The electrical path 110 is comprised of a plurality of tracks 111, each track provided at a single layer of the integrated circuit and connected to the other tracks 111 by interconnecting vias 102. The vias 102 provide interlayer contacts and thus allow the tracks 111 to be connected into a single electrical track 110. In one embodiment, an access contact 104 is connected to ground; another contact 101 is connected to a reference voltage: and connected to various points in the electrical path 110 are transistor-resistor pairs 123. 124, 125. The transistor-resistor pairs 123, 124, 125 are in connected between earth and a third access contact 103. If the electrical path is intact at the track 111 connected to a transistor-resistor pair 123, 124, 125, a current can flow between contact 103 and the respective earth of the transistor-resistor pair 123, 124, 125. By analysing the current drawn from contact 103 it can be deduced whether the path 110 is operational as a whole and if not, how far along the path 110 a fault lies. This can therefore isolate a particular interconnection between layers or a particular layer as being faulty.
申请公布号 EP2224474(A2) 申请公布日期 2010.09.01
申请号 EP20100154913 申请日期 2010.02.26
申请人 MELEXIS TESSENDERLO NV 发明人 DE WINTER, RUDI;BETTS, WILLIAM, ROBERT
分类号 H01L21/66 主分类号 H01L21/66
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