Fabricating method and structure of a wafer level module
摘要
<p>A fabricating method and structure of a wafer level module. A first solid adhesive film with a first release film and a second release film that respectively cover a first surface and a second surface of the first solid adhesive film is provided. Openings are patterned through the first solid adhesive film. After removing the first release films to expose the first surface of the first solid adhesive film, the exposed first surface of the first solid adhesive film is aligned and adhered to a first substrate.</p>
