ELECTRICALLY CONDUCTING RESIN COMPOSITION AND CONTAINER FOR TRANSPORTING SEMICONDUCTOR-RELATED PARTS

摘要

The present invention relates to an electrically conductive resin composition comprising a vapor grown carbon fiber (A1) having an outer fiber diameter of 80 to 500 nm and a resin (B), characterized in that: (1) the vapor grown carbon fiber (A1) has an interlayer spacing (d₀₀₂) of 0.345 nm or less and an aspect ratio of 40 to 1,000, (2) the ratio by volume of the vapor grown carbon fiber (A1) to the resin (B) (i.e., A1/B) is 0.5/99.5 to 12/88, (3) the electrically conductive resin composition has a volume resistivity value of 10⁵ Omegacm or less, and (4) when the resin composition is heated at 80° C. for 30 minutes, the total amount of gases generated therefrom is 5 ppm or less. The present invention also relates to a resin molded product comprising the electrically conductive composition. The electrically conductive resin composition suppresses deposition of a molecular contaminant generated from a resin material onto the surface of a packaged device product. The electrically conductive resin composition of the prevent invention can prevent deterioration of the quality of the product during transportation in the container produced by molding the composition for transporting an electronics-related parts, which leads to reduction of the yield of a final product; and enables washing or thermal drying of a carrier containing electronic parts.