发明名称 Positive resist composition for immersion exposure and pattern-forming method using the same
摘要 <p>A positive resist composition for immersion exposure comprising: (A) a resin having an alicyclic hydrocarbon structure, wherein the resin is capable of increasing a solubility of the resin (A) in an alkaline developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with one of an actinic ray and radiation, wherein the resin (A) includes a component having a molecular weight of 1,000 or less in an area ration of 20% or less to an entire area in a pattern area by gel permeation chromatography, and a pattern-forming method using the same.</p>
申请公布号 EP1684119(A3) 申请公布日期 2010.09.01
申请号 EP20060001309 申请日期 2006.01.23
申请人 FUJIFILM CORPORATION 发明人 KANDA, HIROMI
分类号 G03F7/039;G03F7/004 主分类号 G03F7/039
代理机构 代理人
主权项
地址