| 摘要 |
PURPOSE: A light emitting package and a manufacturing method thereof are provided to improve heat dissipation efficiency by forming an uneven pattern on the rear of a light emitting device package. CONSTITUTION: A package body(110) comprises a cavity(115). A plurality of lead frames are arranged on the cavity of the package body and are separated from the rear of the package body. A light emitting device chip(130) is mounted on the lead frame. The end of the lead frame is extended to the inner or outer direction of the package body in parallel with the rear of the package body. The other end of the lead frame is branched into single or plural pieces from one side of the lead frame.
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