发明名称 |
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>It is an object of the present invention to provide a substrate having a barrier film for preventing copper diffusion having both a barrier function and a catalytic function, wherein the barrier properties during high-temperature heating is excellent. A substrate having, on a base material, a barrier film for preventing copper diffusion comprising one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as platinum, gold, silver and palladium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The said barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.</p> |
申请公布号 |
EP2224472(A1) |
申请公布日期 |
2010.09.01 |
申请号 |
EP20080861759 |
申请日期 |
2008.11.26 |
申请人 |
NIPPON MINING & METALS CO., LTD. |
发明人 |
ITO, JUNICHI;YABE, ATSUSHI;SEKIGUCHI, JUNNOSUKE;IMORI, TORU |
分类号 |
H01L21/768;C23C14/00;C23C14/16;C23C18/16;C23C18/18;C23C18/40;H01L21/285;H01L21/288;H01L21/3205;H01L23/532 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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