摘要 |
PURPOSE: A circuit board for a LED(Light Emitting Diode) is provided to remove a plating process by forming a circuit on a base plate with a printing method. CONSTITUTION: A base plate(10) includes a metal thin plate. An insulating layer(20) is formed on the surface of the base plate. The configuration of a circuit(30) is printed on the upper side of the insulating layer with silver solution. A copper coating layer(40) is formed on the upper side of the circuit configuration in order to improve electric conductance. An insulating surface layer(50) is formed on the upper side of the copper coating layer except for a LED element in order to prevent oxidation. The insulating layer, the circuit configuration, the copper coating layer, and the insulating surface layer are formed with a printing method.
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