发明名称 METHOD OF PREPARING CONDUCTIVE POWDER
摘要 PURPOSE: A manufacturing method of conductive powder is provided to prevent a nickel plating layer from being separated from a core material during a gold-plating process by forming the nickel plating layer with multiple layers on the surface of the core material. CONSTITUTION: A manufacturing method of conductive powder forming a metal electroplating layer on a core material formed with synthetic resin material powder, comprises the following steps: collecting the core material from a tin chloride and palladium chloride solution, and washing the outcome for forming core material slurry; dispersing the core material slurry in a nickel plating solution to form nickel-electroplated powder; dispersing the monolayer nickel-electroplated powder to the nickel plating solution to form a multilayered nickel-electroplated powder; and dispersing the multilayered nickel-electroplated powder to a substituted gold electroplating solution to form the conductive powder.
申请公布号 KR100979281(B1) 申请公布日期 2010.09.01
申请号 KR20100012057 申请日期 2010.02.09
申请人 INCHEON CHEMICAL CO., LTD. 发明人 KIM, KWON WOONG;YOO, GIL JAE
分类号 H01B1/22;H01B5/14 主分类号 H01B1/22
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