发明名称 |
METHOD OF PREPARING CONDUCTIVE POWDER |
摘要 |
PURPOSE: A manufacturing method of conductive powder is provided to prevent a nickel plating layer from being separated from a core material during a gold-plating process by forming the nickel plating layer with multiple layers on the surface of the core material. CONSTITUTION: A manufacturing method of conductive powder forming a metal electroplating layer on a core material formed with synthetic resin material powder, comprises the following steps: collecting the core material from a tin chloride and palladium chloride solution, and washing the outcome for forming core material slurry; dispersing the core material slurry in a nickel plating solution to form nickel-electroplated powder; dispersing the monolayer nickel-electroplated powder to the nickel plating solution to form a multilayered nickel-electroplated powder; and dispersing the multilayered nickel-electroplated powder to a substituted gold electroplating solution to form the conductive powder.
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申请公布号 |
KR100979281(B1) |
申请公布日期 |
2010.09.01 |
申请号 |
KR20100012057 |
申请日期 |
2010.02.09 |
申请人 |
INCHEON CHEMICAL CO., LTD. |
发明人 |
KIM, KWON WOONG;YOO, GIL JAE |
分类号 |
H01B1/22;H01B5/14 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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