METHOD FOR THE PRODUCTION OF AN OPTOELECTRONIC COMPONENT USING THIN-FILM TECHNOLOGY

摘要

On an epitaxy substrate (1), a layer structure (5, 6, 7) provided for light-emitting diodes or other optoelectronic components using thin-film technology is produced and provided with a first connecting layer (2), which comprises one or a plurality of solder materials. A second connecting layer (3) is applied over the whole area on a carrier (10) and permanently connected to the first connecting layer (2) by means of a soldering process.