| 发明名称 |
Insulating aperture in printed circuit boards |
| 摘要 |
<p>A system contains a temperature sensitive device and a printed circuit board. The temperature sensitive device is coupled to the printed circuit board. An aperture is cut out of the printed circuit board between the temperature sensitive device and a heat generating device to act as an insulator for the temperature sensitive device.</p> |
| 申请公布号 |
GB201012152(D0) |
申请公布日期 |
2010.09.01 |
| 申请号 |
GB20100012152 |
申请日期 |
2008.01.31 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
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