发明名称 Multilayer type test board assembly for high-precision inspection
摘要 There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.
申请公布号 US7786721(B2) 申请公布日期 2010.08.31
申请号 US20080006543 申请日期 2008.01.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM MIN-GU;AN YOUNG-SOO;CHOI HO-JEONG;KIM JUNG-HYEON
分类号 G01R31/28;G01R31/26 主分类号 G01R31/28
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