| 摘要 |
An electronic semiconductor package is described. The package has a wide band gap electronic semiconductor device requiring heat removal. On one side of the electronic semiconductor device is a first, thermally-conductive, electrically-insulative substrate having a predetermined electrically-conductive wire pattern affixed thereto. On the other side of the electronic semiconductor device is a second, thermally-conductive, electrically-insulative substrate. A heat removal device is mechanically-coupled to the second substrate. The heat removal device is made of a graphite-metal or metal-matrix composite material and a fin array structure of the same material. The coefficients of thermal expansion of the heat removal device and the first and second substrates are matched to minimize internal and external stresses.
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