| 摘要 |
A resin-sealed semiconductor device includes a metal frame, an electronic substrate, an adhesive agent, a molded resin, and a bonding agent. The electronic substrate includes a first surface having a circuit element wiring part, a second surface facing the metal frame, and a side surface arranged approximately perpendicularly to the first surface and the second surface. The adhesive agent is disposed between the metal frame and the second surface to cover the second surface and a portion of the side surface adjacent to the second surface. The molded resin covers the metal frame and the electronic substrate, and holds the other portion of the side surface adjacent to the first surface. The bonding agent is disposed between the circuit element wiring part and the molded resin so that the molded resin holds the circuit element wiring part through the bonding agent.
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