| 发明名称 |
Underfill compositions and methods for use thereof |
| 摘要 |
The invention is based on the discovery that certain polyester-linked compounds are useful as components in underfill compositions for the microelectronic packaging industry.
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| 申请公布号 |
US7786248(B2) |
申请公布日期 |
2010.08.31 |
| 申请号 |
US20050207987 |
申请日期 |
2005.08.19 |
| 申请人 |
DESIGNER MOLECULES, INC. |
发明人 |
DERSHEM STEPHEN M.;FORRAY DEBBIE |
| 分类号 |
C08G63/00;C08G63/02;C09K3/00 |
主分类号 |
C08G63/00 |
| 代理机构 |
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