发明名称 |
Thin multichip flex-module |
摘要 |
A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.
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申请公布号 |
US7787254(B2) |
申请公布日期 |
2010.08.31 |
申请号 |
US20070715205 |
申请日期 |
2007.03.07 |
申请人 |
MICROELECTRONICS ASSEMBLY TECHNOLOGIES, INC. |
发明人 |
CLAYTON JAMES E.;FATHI ZAKARYAE |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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