| 摘要 |
A communication device (110, 210) has an antenna (150, 152, 250, 252) positioned on a multilayer substrate/printed circuit board (154, 254, 254′). A first high frequency material (116, 216) is disposed over a first side of the substrate (154, 254) characterized for low frequency devices. A conductive layer (118, 218) is patterned over the first high frequency material (116, 216), defining first and second circuit traces (122, 124, 222, 224) and first and second antenna traces (132, 134, 232, 234). The first and second antenna traces (132, 134, 232, 234) define a first slot (116, 216) in the first conductive layer (122, 222), which is aligned with a cutout (162, 262) defined by the substrate (154, 254). One of a transmitter (112, 212) and a receiver (114, 214) are disposed over the high frequency material (116, 216) and coupled to the edge emitting antenna (150, 250) by the first and second circuit traces (122, 124, 222, 224). The other of the transmitter (112) and receiver (114) may be positioned on the same or opposed side (aligned or staggered) of the substrate (254) in a similar manner. One or more layers (262), which may be patterned to provide resonant features, are formed between the substrate (254, 254′) for isolation.
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