发明名称 |
Modification of connections between a die package and a system board |
摘要 |
Modification of the connections between a die package and a system board is described. In one example a pattern redistribution module is used in a socket. The module has a first array of contacts on one side of the module. The contacts have a first configuration to connect to the socket. A second array of contacts is on another side of the module opposite the first array of contacts and has a second configuration to connect to a package containing a die. A board is between the first and the second array of contacts to interconnect contacts of the first array of contacts to contacts of the second array of contacts.
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申请公布号 |
US7785114(B2) |
申请公布日期 |
2010.08.31 |
申请号 |
US20080217077 |
申请日期 |
2008.06.30 |
申请人 |
INTEL CORPORATION |
发明人 |
BRIST GARY;RUTTAN TOM;ZARBOCK TED |
分类号 |
H01L21/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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