发明名称 |
DEVICE FOR POLISHING THE EDGE OF A SEMICONDUCTOR SUBSTRATE |
摘要 |
<p>The invention relates to a device for chemical and mechanical polishing of the edge of a semiconductor substrate comprising a protruding residual topography in a peripheral region of the substrate resulting from a layer transfer process based on an ion implantation step, a bonding step and a detachment step, such as Smart-CutTM. To be able to remove this step- like region, the device comprises a polishing pad, wherein the polishing pad is arranged and configured such that its cross section in a plane perpendicular to the surface of a substrate holder is curved. The invention furthermore relates to a pad holder used in the device and a method for polishing a semiconductor substrate comprising a protruding residual topography.</p> |
申请公布号 |
SG163468(A1) |
申请公布日期 |
2010.08.30 |
申请号 |
SG20090071804 |
申请日期 |
2009.10.29 |
申请人 |
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES |
发明人 |
SCHWARZENBACH, WALTER;KERDILES, SEBASTIEN;ALAMI-IDRISSI, AZIZ |
分类号 |
B24B37/04 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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