| 摘要 |
PURPOSE: A resin composition is provided to be suitable for forming an insulating layer of a multilayered printed wire board, to have a low dissipation factor of the insulating layer, and to more stably maintain adhesive force between the insulating layer and a conductive layer at a high temperature and high humidity. CONSTITUTION: A resin composition contains an epoxy resin, a cyanate ester resin, an active ester hardener, and a curing accelerator. The curing accelerator is selected from a metal-based curing accelerator, an amine-based curing accelerator, or an imidazole-based curing accelerator. The content of the epoxy resin is 5-60 weight% and the content of the cyanate ester resin is 5-50 weight%. The content of the active ester hardener is 2-20 weight% based on 100 weight% of non-volatile fractions of the resin composition. |
