| 摘要 |
<p>A flexible membrane is mounted in an interior of a body of a carrier of a chemical mechanical polishing apparatus and separates the interior of the carrier into three independent airtight chambers each having a pressurizable duct interconnected thereto. Under control of filling or exhausting air via the ducts, the flexible membrane can deform to control the carrier to vacuum chuck or press against a wafer in a polishing process. The flexible membrane is made of silicone with high cleanliness, and one layer of poly-para- xylylene is coated on a lower side of the flexible membrane by vacuum micro coating to form a wafer contact surface, thereby reducing pollution to the wafer by the flexible membrane as well as avoiding the wafer from slipping in the wafer polishing process, achieving high yield and cutting costs.</p> |
