Methods of fabricating surgical blades from silicon wafers by etching
摘要
A method of forming a blade from a silicon wafer 202 by first cutting a V shaped trench on one surface of the silicon wafer 202 and then uniformly etching the V shaped trench until a blade is formed.
申请公布号
NZ551031(A)
申请公布日期
2010.08.27
申请号
NZ20050551031
申请日期
2005.04.29
申请人
BECTON DICKINSON AND COMPANY
发明人
HUGHES, JAMES;DASKAL, VADIM;KEENAN, JOSEPH;KISS, ATTILA;CHAVEZ, SUSAN
