METHOD OF PLATING AND PLATING STRUCTURE

摘要

PURPOSE: A plating method and a plating structure are provided to form an additional plating layer excluding nickel plating on an anodized metal surface, thereby achieving a stereoscopic plating structure. CONSTITUTION: A plating method comprises steps of: removing a metal layer exposed by removing a masking layer, forming a metal pattern on the metal layer, and partially anodizing the metal layer exposed around the metal pattern to form an oxidation layer(130). The metal pattern is obtained by forming the masking film out of a masking material on the metal layer and plating the metal layer from which the masking film is removed.