| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which has a charged particle implanting process using a stencil mask, and also which has higher yield of manufacture and in which faults hardly occur. SOLUTION: The method of manufacturing the semiconductor device is provided with a stencil mask fixing step of bringing the stencil mask 20 masking part of a semiconductor device region 12 of a semiconductor wafer 10 into contact with a non-semiconductor device region 14 and fixing it to the semiconductor wafer 10 without bringing the mask into contact with the semiconductor device region 12 and a charged particle implanting step of implanting charged particles to the semiconductor wafer 10 across the stencil mask 20. COPYRIGHT: (C)2010,JPO&INPIT |
