Soldering product that is compounded from metallic component and soldered in a soldering furnace, where a solder collecting device is formed on the component of the soldering product and is removed after termination of soldering process

摘要

The soldering product that is compounded from metallic component and is soldered in a soldering furnace is claimed. A solder collecting device (5) is formed on the component of the soldering product and is removed after termination of the soldering process of the soldering product. The solder collecting device has a column for the component at which it is formed. The column is dimensioned so that the collected solder does not reach the component and/or the product but it is adhered on the solder collecting device. The soldering product that is compounded from metallic component and is soldered in a soldering furnace is claimed. A solder collecting device (5) is formed on the component of the soldering product and is removed after termination of the soldering process of the soldering product. The solder collecting device has a column for the component at which it is formed. The column is dimensioned so that the collected solder does not reach the component and/or the product but it is adhered on the solder collecting device. The solder collecting device is a rail that has residual connection place for the product arranged in an interval that is detachable after the connection of the soldering process. The solder collecting device has interruptions or cuttings in its longitudinal extent and is produced in forming technical production. The solder exists as solder coating on individual component of the solder product. An independent claim is included for a method for the production of soldered product.